On February 1, UJU participated in the connector exhibition ‘DesignCon 2023,’ held in Santa Clara, California, USA.

At this DesingCon 2023, UJU introduced the BQ series of ultra-small Board to Board connectors.
The BQ series has a 0.3mm pitch and is the smallest among existing mobile connector products. It supports connection in extremely narrow spaces required for devices such as mobile devices and wearable devices.

An employee of UJU said, “We are pleased that our core technology has been recognized by many buyers,” and “Participating in this exhibition will be a great driving force for our global market expansion.”

For more information on designcon 2023, visit the website (https://www.designcon.com)